蘋(píng)果手機(jī)iPhone折疊屏臺(tái)積電芯片與SG2016CAN愛(ài)普生晶振X1G004801005600
目前市場(chǎng)調(diào)研機(jī)構(gòu)數(shù)據(jù),近年來(lái)臺(tái)積電來(lái)自蘋(píng)果手機(jī)的收入比重逐漸提高.在臺(tái)積電的前十大客戶(hù)中,蘋(píng)果手機(jī)占據(jù)其中收入的比重也從2016年的25%提高到2022年的37%.愛(ài)普生晶振可以看到蘋(píng)果在2021年貢獻(xiàn)給臺(tái)積電148億美元的營(yíng)收,其他所有客戶(hù)貢獻(xiàn)的營(yíng)收也不過(guò)420億美元,畢竟蘋(píng)果iPhone/iPad的A系列及M1/M2系列芯片都是臺(tái)積電代工,而且都是最先進(jìn)的7nm、5nm工藝,價(jià)格高,產(chǎn)量大,營(yíng)收占比自然就高出其他廠商.
時(shí)間倒回到2019年,華為當(dāng)年是臺(tái)積電第二大客戶(hù),當(dāng)時(shí)蘋(píng)果營(yíng)收占比23%左右,華為占比達(dá)到了14%,如果沒(méi)有美國(guó)的限制,日產(chǎn)晶振華為近年來(lái)也會(huì)有大量自研芯片交由臺(tái)積電代工,可惜麒麟9000之后芯片已經(jīng)絕版.
SG2016CAN愛(ài)普生晶振X1G004801005600,蘋(píng)果手機(jī)iPhone折疊屏晶振
愛(ài)普生有源晶振編碼
型號(hào)
頻率
長(zhǎng)X寬X高
輸出波
電源電壓
工作溫度
頻差
最大值
X1G004801004600
SG2016CAN
8.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801004900
SG2016CAN
4.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801005000
SG2016CAN
12.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤1.8mA
X1G004801005100
SG2016CAN
12.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801005200
SG2016CAN
12.288000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤1.8mA
X1G004801005300
SG2016CAN
12.288000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801005400
SG2016CAN
14.745600MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤1.8mA
X1G004801005500
SG2016CAN
14.745600MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801005600
SG2016CAN
16.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤1.8mA
X1G004801005700
SG2016CAN
20.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤1.8mA
X1G004801005800
SG2016CAN
20.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤1.8mA
X1G004801005900
SG2016CAN
24.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤2.2mA
X1G004801006000
SG2016CAN
24.576000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤2.2mA
X1G004801006100
SG2016CAN
27.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤2.2mA
X1G004801006200
SG2016CAN
32.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤2.2mA
X1G004801006300
SG2016CAN
32.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤2.2mA
X1G004801006400
SG2016CAN
33.330000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤2.2mA
X1G004801006500
SG2016CAN
33.330000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤2.2mA
X1G004801006600
SG2016CAN
33.333300MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤2.2mA
X1G004801006700
SG2016CAN
40.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to85°C
+/-50ppm
≤2.2mA
X1G004801006800
SG2016CAN
48.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤2.6mA
X1G004801006900
SG2016CAN
48.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-40to105°C
+/-50ppm
≤2.6mA
X1G004801007000
SG2016CAN
50.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤2.6mA
X1G004801007100
SG2016CAN
72.000000MHz
2.00x1.60x0.70mm
CMOS
1.710to3.630V
-20to70°C
+/-25ppm
≤3.0mA
X1G004801007200
SG2016CAN
72.000000MHz
2.00x1.60x0.70mm
CMOS
1.710to3.630V
-40to85°C
+/-50ppm
≤3.0mA
X1G004801007300
SG2016CAN
72.000000MHz
2.00x1.60x0.70mm
CMOS
2.250to3.630V
-40to105°C
+/-50ppm
≤3.0mA
X1G004801007600
SG2016CAN
32.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤2.2mA
X1G004801007700
SG2016CAN
26.000000MHz
2.00x1.60x0.70mm
CMOS
1.600to3.630V
-20to70°C
+/-25ppm
≤2.2mA
在這以后臺(tái)積電對(duì)蘋(píng)果的依賴(lài)不斷提升,考慮到2022年下半年芯片市場(chǎng)由緊缺轉(zhuǎn)向過(guò)剩,很多客戶(hù)會(huì)砍單,而蘋(píng)果受手機(jī)、PC銷(xiāo)量下滑的影響較小,預(yù)計(jì)在臺(tái)積電的營(yíng)收占比可能會(huì)進(jìn)一步提升.
2022年蘋(píng)果占據(jù)臺(tái)積電收入的比重達(dá)37%臺(tái)積電是全球最大也是工藝最先進(jìn)的晶圓代工廠,日本進(jìn)口晶振無(wú)晶圓芯片設(shè)計(jì)公司幾乎都要依賴(lài)臺(tái)積電代工,包括蘋(píng)果、AMD、高通、聯(lián)發(fā)科、NVIDIA等等,其中蘋(píng)果當(dāng)之無(wú)愧地成為臺(tái)積電第一大客戶(hù),而且依賴(lài)程度越來(lái)越高,2021年近4成收入都來(lái)自蘋(píng)果手機(jī).
SG2016CAN愛(ài)普生晶振X1G004801005600,蘋(píng)果手機(jī)iPhone折疊屏晶振